On October 22, 2024, the Federal Aviation Administration (FAA) issued a long-awaited final rule providing new and amended regulations and standards to govern powered vertical-takeoff and -landing, low ...
Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs ...
Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...
In a new review article publication from Opto-Electronic Advances, Yingtao Hu, Di Liang and, Raymond G. Beausoleil from Hewlett Packard Labs discuss advanced III-V-on-silicon photonic integration.
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