The entire stress-strain curve can now be determined using nanoindentation with a flat-ended cylindrical punch and novel analysis of the resulting force-displacement data 1. Unlike pyramidal indenters ...
A recent research published in Engineering has unveiled a novel analysis-oriented stress–strain model that promises to revolutionize the way engineers understand and design with ultra-high-performance ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
In demanding applications, structural materials can be subject to both high temperatures and high stresses at the same time. The combination of temperature and stress in metals often leads to ...
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