One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...
The Benefits Of Curvilinear Full-Chip Inverse Lithography Technology With Mask-Wafer Co-Optimization
A technical paper titled “Make the impossible possible: use variable-shaped beam mask writers and curvilinear full-chip inverse lithography technology for 193i contacts/vias with mask-wafer ...
VELDHOVEN, the Netherlands--(BUSINESS WIRE)--Brion Technologies, a division of ASML, today announces a new product for semiconductor manufacturers who need the most powerful computational lithography ...
“Full-chip curvilinear inverse lithography technology (ILT) requires mask writers to write full reticle curvilinear mask patterns in a reasonable write time. We jointly study and present the benefits ...
Concept of mask/wafer co-optimization by moving the shot with mask and wafer double simulation to minimize wafer error. VSB shot configurations and its corresponding ...
Mask tool promises to cut chip mask costs A new software tool that can reduce the number of masks needed to manufacture ICs leverages a proprietary scheme that prints several mask layers on the same ...
Glass masks contribute to EUV mask blanks market expansion by offering exceptional surface smoothness, dimensional stability, ...
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