Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...
An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) here today announced it has licensed proprietary pillar-bumped technology from Singapore-based Advanpack Solutions Pte. Ltd. for flip ...
Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...
Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...
Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350 million in ...
Samsung Electronics has confirmed that it is preparing for the trial production of flip-chip ball grid array (FC-BGA) in Vietnam and plans to start mass production in July 2023 at its factory in Thai ...
Apple is continuing its work on the upcoming "M2" chip with help from Samsung Electro-Mechanics, ET News reports. Samsung Electro-Mechanics supplies the flip chip ball grid array (FC-BGA), a printed ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback