The use of memory-heavy IP in SoCs for automotive, artificial intelligence (AI), and processor applications is steadily increasing. However, these memory-heavy IP often have only a single access point ...
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory ...
LOS ALTOS, Calif. — Rambus Inc. has a flexible phase technology that it claims makes its next generation memory interface easier and lower cost to design with. The Los Altos-based company has ...
An AMD patent application for a new spin on DDR5 PC memory has been spotted. The so-called high-bandwidth dual inline memory module or HB-DIMM is designed to boost memory bandwidth courtesy of pseudo ...
Issues in GDDR6 design. In-design analysis for signal integrity and power integrity. Innovative workflow for GDDR6 design and analysis. Graphics processing units (GPUs) and graphics double-data-rate ...
The folks from Xilinx and the guys and gals from Micron Technology have just announced the first public hardware demonstration of an FPGA interfacing with RLDRAM 3 memory. RLDRAM 3 is a new and ...
Good morning everyone. We just got some interesting information from Rambus regarding their new high-speed XDR memory interface that we wanted to send your way. If you think GDDR3 RAM running at ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
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