The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
No automatic method exists to insert the different and multiple RLC package/PCB models of the Chip in Mix Mode (RTL + Spice) AMS verification. Such additions of components are inserted in simulation ...
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