Innovation paves the way for a high-volume, silicon photonics 400G/lane platform to meet next-generation 3.2T optical communication architectures for datacom and AI applications. The integrated ...

A device smaller than a grain of dust may help unlock the kind of quantum computers people have only dreamed about. Built on ...

Why AI needs high-speed interconnects. How multichannel fiber meets AI demands. How multichannel fiber support fits on a chip. Though copper provides high-speed connectivity, it has limitations. One ...

This study demonstrates a compact optical modulation platform that enables real-time, high-resolution spectroscopy using sub-MHz interleaved combs generated via chip-scale acousto-optic phase ...

HyperLight, creator of the TFLN Chiplet™platform, today announced the launch of the industry’s first 110 GHz IQ packaged modulators, available in both standard and low-Vπ versions. These 110 GHz IQ ...

Researchers at EPFL and Harvard University have engineered a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device. Their integrated design could ...

The advent of big data era raising significant challenges in information processing, especially in the aspect of capacity and power consumption. Situations become even worse when we consider the fact ...

How a single silicon chip was designed to be microwave and optical signal-processing engine. The various roles for which this engine can be reconfigured. The performance considerations that were ...

Impressively, the unit registered the lowest frequency loss of any chip to date. Specifically, the engineers noted that the new chip was 15x more stable and 100x more efficient in terms of microwave ...

A Carlsbad, Calif. startup expects to ship components in 2006 built using standard chip manufacturing techniques designed to allow chip makers, networking companies and server vendors to improve ...