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A new PCB design can boost heat dissipation by 55x – copper coins placed under heat generating components drop temps drasticallyOKI Circuit Technology has announced a new printed circuit board (PCB) design that can boost component heat dissipation by up to 55x. The Japanese firm has been developing and manufacturing PCBs ...
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GMG's THERMAL-XR(R) Demonstrates Potential for Electronics Heat Sink Miniaturization and EfficiencyAs PCB density increases, higher current loads lead to more heat, with 5.2 billion units expected to require heat sinks for cooling. THERMAL-XR ® coated on the heat sinks, enhances the heat sink ...
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