TL;DR: Intel's 18A process node, set for tape-out in 1H 2025, aims to compete with TSMC, marking a significant comeback for Intel in the semiconductor industry. Featuring BSPDN, RibbonFET GAA ...
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Intel Foundry Roadmap Update - New 18A-PT variant that enables 3D die stacking, 14A process node enablement
Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced ...
Intel has made some major changes and announcements concerning upcoming products and how future improvements to the company's manufacturing will be communicated. These changes will have a significant ...
As the semiconductor industry continues to push the boundaries of innovation with advanced nodes, it is easy to overlook the critical role that ICs manufactured at legacy process nodes play in our ...
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