The semiconductor shortage has curtailed the choices available to designers and caused some inventive solutions to be found, but the one used by [djzc] is probably the most inventive we’ve yet seen.
Bristol, PA September 2013 – Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products and test sockets used worldwide, announces its new 250°C QFP/QFN Test ...
New strip etch QFN version supports a wide range of die sizes, die stacking and higher I/O Singapore – 11/25/2008, United States – 11/24/2008 – STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – ...
Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies ...
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