Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...
Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...
It will be at least two years before EUV is ready, and talk about larger wafers will be stalled until then. Whether the wafers in question are 200 mm in diameter, or 300 mm, or potentially 450 mm, ...
Keysight Technologies has unveiled WaferPro Express 2015, a measurement software platform for the automated characterization of wafer-level devices and circuit components. By efficiently controlling ...
Improving on product overlay is one of the key challenges when shrinking technology nodes in semiconductor manufacturing. . . . With smart placement of alignment mark pairs in the X and Y direction, ...
The solar industry must work together to agree on standardised larger wafer sizes, according to monocrystalline solar manufacturer LONGi Group. The company has revealed that its H-MO4 module, which ...
Silicon photonics is one of the key emerging technologies addressing growing internet traffic and demand for higher data rate. Silicon photonics’ primary applications are in the data center market, ...
SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to ...
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