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Breakthrough 3D wiring architecture enables 10,000-qubit quantum processors
The novel 3D wiring architecture and chip fabrication method enable quantum processing units containing 10,000 qubits to fit ...
Siemens and nVent are collaborating to develop a liquid cooling and power reference architecture, purpose-built for ...
G RedCap delivers the reliable, energy-efficient connectivity needed to prevent downtime, power automation and help factories scale safely.
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