TSMC now requires Chinese IC designers that use FinFET-based process technologies to package them at U.S. government-approved ...
Accelerating multi-die, multi-chip SoC designs The Cadence® 112Gbps Extra Short Reach (XSR) SerDes IP for TSMC 7nm consists of eight lanes operating at 112Gigabit per second using PAM4 modulation.
It continued: "To support this transition, GlobalFoundries is putting its 7nm FinFET program on hold indefinitely ... Instead of competing directly with TSMC, Samsung and Intel at the cutting ...
TSMC management has indicated enormous AI opportunity for its foundry business, particularly for GPUs and ASICs. See why I ...
TSMC is continuing to back the 7nm FinFET (Fin Field Effect Transistor) process for 5nm - essentially a "3D" non-planar transistor that resembles a fin. Hence the name. However, despite the fact ...
At 10nm/7nm, chipmakers followed the same path to scale finFETs. In 2018, TSMC shipped the first 7nm finFET process, followed by Samsung. Meanwhile, Intel last year shipped 10nm after several delays.
For example, Samsung is shipping various processes based on finFETs at 7nm and 5nm, with plans to introduce nanosheets at 3nm in 2022/2023. Meanwhile, TSMC will extend the finFET to 3nm, but will ...
Apple chip manufacturer TSMC is reportedly on schedule to deliver prototype chips using its new 7nm process by the summer of this year. Provided everything else runs on schedule, that should mean ...
IGMTLSV03A is a synchronous ULVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 16nm 0.8V/1.8V CMOS LOGIC FinFET Compact process. Different combinations ..
TSMC's FY24 performance exceeded expectations ... while its cutting-edge 5nm and 7nm sales also realised healthy growth rates of 33.9% and 16.3%, respectively. Nonetheless, we were happy about ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results