In November 2023, Apple signed a deal with Amkor to package its Apple Silicon at the Peoria facility, which TSMC will produce at its nearby Phoenix fab. As a result of the deal, Apple became the “first and largest” customer at Amkor’s new plant.

If this news sounds familiar it’s because Apple confirmed its own deal with Amkor to package Apple Silicon at TSMC last November. This made Apple the “first and largest” customer at Amkor’s new manufacturing plant, which at that time was billed as the “largest advanced packaging facility in the US.”

Taiwan's TSMC has inked a deal with US semiconductor outfit Amkor Technology to beef up advanced chip packaging on American soil. The Memorandum of Understanding marks another step in bolstering the US chip supply chain and the country's standing in the global market – a key objective supported by the CHIPS Act.

TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services,

TSMC is expanding the capabilities of its chip plant in Arizona by partnering with the US-based Amkor Technology to add advanced packaging and test capabilities. The move will result in more US-based Apple chip production in the future.

Apple’s chip-making partner TSMC and chip packaging company Amkor announced on Thursday that they’ve agreed in principle to collaborate on chip production, packaging, and testing in their Arizona facilities. The two companies say the close proximities of their facilities in Arizona will accelerate the overall chip manufacturing process:

Taiwan Semiconductor Manufacturing (TSM) has released an update. Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology, Inc. have announced a collaboration to enhance advanced semiconductor packaging and testing capabilities in Arizona,

Apple's chip manufacturer TSMC and chip packaging company Amkor on Thursday announced that the two companies have signed a memorandum

TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver advanced packaging and testing services in Arizona.

Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications.